InSource efficient electronics means increasing productivity and reducing cost.

Built Efficient.

The value of InSource Electronics extends beyond PCB Assembly.

SMT Quick Facts
Largest PCB330 mm x 250 mm panel
Smallest PCB50 mm x 30 mm panel but we can fit multiple smaller boards per panel.
Min. component size0201
Min component pitch0.4 mm
Max component size33.5 mm sq. (can hand place larger components)
BGA placement3×3 min grid
0.25 mm min pitch
624+ max # of balls actually placed, software shows larger allowed
3 SMT lines2 lines with 2 placement machines each, 1 line with 1.
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Overview
We build boards but so much more. Box builds, Turn key, Smart Rugged Modules. SMT, BGA, Rohs. Custom products built to your needs.
Hardware Design
We apply a deep understanding of field application, manufacturing process issues, and design experience to achieve manufacturable designs.
Flexible and Responsive
Our reputation is built around quick launches, flexible production schedules, and response to changes in demand. We acquired surface mount capabilities to improve our laser focus on change management.
Data Driven Process
Our data systems control bills of materials (BOMs), verify reel setup, and automatically inspect each component (AOI). We monitor and act on process measurement data and defect root cause analysis.
Surface Mount Assembly
We maintain 25% excess capacity in automated equipment to maintain schedules and provide for growth. Our lines are up to date and capable of tight process control. We build flexible circuit, metal backed PCB’s.
Through Hole Soldering
Surface mount components are used wherever possible. Most other components are compatible with our robotic soldering equipment. Hand soldering is used for direct wire and cable attachment. IPC-610 – 28 certified solderers, 1 trainer. IPC J-STD-001 certified
Wire Harness Integration
With a successful Harness Unit in our facility, we have the capabilities to install/route wire harnesses into our Box Builds.
Final Assembly
Our Final Assembly is perfected and ready to meet customer needs.
Packaging
 custom options are vailable
Testing/Inspection
Every Box Build unit that leaves this facility is tested and inspected by our production team.

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Rugged Smart Modules
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Overview
Board to Board communication means Smart. InSource can manage your Smart Module manufacturing. DC voltage range, mobile, rugged, weatherized.
Testing/Inspection

Whether assembled into a plastic enclosure or potted into a box, every device is tested at least once. We have a custom defect tracking system to provide feedback for design and process improvements.

  • SPI (Solder Paste Inspection)
  • AOI (Automatic Optical Inspection)
  • X-ray for Offline Verification
  • Software Programming
  • Bed of Nails Testing
  • Full Functionality
Potting
2 part epoxy, machined applied gives metered dose for consistency:

   Ellsworth EP1282, EP1121 – Both cure as hard black

   Ellsworth 3-4222 – This is a silicone that cures as a clear flexible gel

   Ellsworth UR3001 – This is a urethane that cures as a softer black flexible potting

Overmolding
board overmold using low pressure injection machine. custom tooling, 
Plastic Design
Protect your board, Solidworks modeling

Turnkey Electronic Products - Box Build Electronics
working circuit
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Overview
Your leader in Turnkey Electronic Products. Use our custom manufacturing skills to UNLOCK your company bottlenecks and bring profits to your bottom line.
Testing – machine or manual inspection

Whether assembled into a plastic enclosure or potted into a box, every device is tested at least once. We have a custom defect tracking system to provide feedback for design and process improvements.

  • SPI
  • AOI
  • X-ray for Offline Verification
  • Software Programming
  • Bed of Nails Testing
  • Full Functionality
Calibration
Calibration tools available.

“Akron Brass designs and manufactures custom products with short lead times. InSource Technologies has listened and made it happen. They are an important part of our business.”
– Brad M. – Akron Brass Company